News
June 8, 2026
Lotus Microsystems Launches First vStrata™ Module, a Vertical Power Delivery Platform Designed to Break Through Power and Thermal Limits in AI Infrastructure
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May 28, 2026
Lotus Microsystems Partners with MEV Elektronik Service to Expand Presence in the DACH Market
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April 16, 2026
Lotus Microsystems at DTU Chip Day 2026
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March 30, 2026
New Brief: Vertical LTG Integration in 800G+ Optical Transceiver Modules
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March 12, 2026
RePower-HPC: Revolutionizing Power Delivery for AI and High-Performance Computing
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March 11, 2026
Lotus Microsystems Joins the Altera Solution Acceleration Partner (ASAP) Program
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October 7, 2025
CTO Yasser Nour joined the panel: “Inside AI’s core: Building the Infrastructure of the Future” at TechBBQ conference
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September 18, 2025
New LTG Whitepaper: Smarter Thermal Management for High-Performance Electronics
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September 11, 2025
Lotus Microsystems and EDOM Technology Form Strategic Distribution Partnership to Expand Presence Across APAC
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September 10, 2025
Find your way to EU millions: Here is the recipe [DK]
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April 3, 2025
Preventing LED Overheating: The Key to Long-Term Performance
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February 1, 2025
Stefan Stockbauer Joins Lotus Microsystems as Director of Sales and Marketing
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April 9, 2024
Lotus Microsystems CEO Featured in ipXchange Interview on Power Electronics Innovation
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December 15, 2023
Lotus Microsystems Secures DKK 60 Million Funding and Appoints Hans Hasselby-Andersen as CEO
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