We deliver the best-in-class power density and highest thermal performance
2.5D and 3D packaging for power modules with integrated active and/or passive devices
Even heat distribution of power devices across substrate in vertical and lateral paths
Enabled by lower operating temperatures, reduced parasitics, and larger budget for passive devices
Co-packaging of different technologies, e.g. CMOS, MEMS, GaN, and integrated passive devices (IPDs)
Lotus Microsystems brings advanced packaging to the power management domain. Our proprietary power interposer technology enables the employment of silicon interposers in power applications. The interposer design and processing is optimized to carry higher currents and withstand higher voltages.
Thick-copper redistribution layers (RDL) patterning
Double-sided wafer routing
Precise silicon etching
High-aspect ratio through-silicon-vias (TSV)
Compared to the state-of-the-art power module packaging based on laminate substrates and lead frames, the Lotus Power InterposerTM offers up to 60% improvement in thermal performance, with elimination of hot spots. That allows for higher power density and less derating for the same maximum allowable temperature on the application platform.
With the current levels into a single package exceeding 1000 A, unprecedented challenges for the placement and thermal management of point-of-load converters. Innovative packaging solutions that allow for closer placement of the power converters to the load and elimination of hot-spots are in high demand. Get in touch to learn more about Lotus Microsystems´ unique offerings for Voltage Regulator Modules (VRM) for high power AI chips, GPUs and FPGAs.
Power-System-in-Package (PSiP) solutions are employed in a number of industrial applications, e.g. telecom and networking, with specific needs for high-power-density converters with high noise immunity and improved dynamics. Get in touch to learn more about Lotus Microsystems´ PSiP offerings for optical transceivers and mmWave compact macro platforms.
The ongoing push for increasing processing speeds (AI on the edge), higher bandwidth communication (5G, 6G), and integrating more functions into form-factor specific devices places strict requirements on the size and thermal management of platform power management and delivery system. The Lotus Power Interposer offers unique features that allows for pushing the industry´s figures of merit for W/mm2 and °C/W to new frontiers to cope with the market demand.
Thermal Guide
Elecritically-Isolated SMT Thermal Jumper
Miniaturized Step-Down Power Supply in Package
4A Synchronous Buck Converter
Miniaturized Step-Down Power Supply in Package
100 mA Synchronous Boost Converter
Lotus Microsystems is a fabless manufacturer of highly-integrated power modules. The company was incorporated in 2020 by three Ph.D. graduates from the Technical University of Denmark (DTU) with expertise in nanofabrication, integrated circuit design, and power electronics. The research behind the technology started five years earlier and spanned across DTU, Harvard University, Fraunhofer, and IMEC. The company has received financial backing from Danish and European grant schemes, in addition to a number of investment rounds primarily led by deep-tech venture firm Noon Ventures. Through partnerships with leading global semiconductor facilities, Lotus Microsystems serves the industry demand for for high power density and superior thermal performance in feature-rich electronic devices.
Lotus Microsystems main office is located in Copenhagen, Denmark, with a company subsidiary based in Cairo, Egypt.
CEO
CTO, Co-Founder
Head of Product, Co-Founder
Head of R&D, Co-Founder
Director of Operations
Sales Director
CPH Business Park
Stamholmen 153
2650 Hvidovre
Denmark
CVR: 41950250
info@lotus-microsystems.com
