Redefining Power and Thermal Limits in the AI Era

Enabling AI at Data Center Scale

Data centers built for AI and High-Performance Computing demand a fundamental rethinking of power and thermal control. We define a new platform that converges power delivery and thermal management into a unified, purpose-built platform for the next generation of AI and advanced computing.

Fully Integrated Design
No external passives required, minimizing parasitics, simplifying system architecture, and saving board space.
Optimized For Vertical Power Delivery
An ultra-slim package profile enables low-profile backside power delivery with a tight fit to the load.
Industry-Leading Power Efficiency
Delivers the highest efficiency in the industry, minimizing self-heating to remove a major constraint in densely packed AI, ML, and HPC systems.
Higher Solution-Level Current Density
The integrated architecture delivers more than double the current density of leading alternatives, enabling compact, scalable power delivery for advanced accelerators.

Applications

AI Accelerators and xPU Modules

High-current, low-voltage power delivery for next-generation xPUs and custom AI accelerators operating at extreme power density.

Hyperscale Data Center Compute Trays

Power solutions enabling higher rack density, improved energy efficiency, and reduced cooling overhead in hyperscale and cloud infrastructure.

HPC and Supercomputing Systems

Multi-kilowatt power delivery for tightly coupled compute clusters where efficiency and thermal headroom directly translate to performance.

See all applications
New Technical Solution Brief

Vertical LTG - 800G+ Optical Transceiver Modules

We have released a new brief on Vertical LTG integration in 800G+ optical transceivers, covering the conduction model, integration strategies, and key design considerations for reliable thermal performance.
Technical Solution Brief
New collaboartion

Altera Solution Acceleration Partner Program

Thermal bottlenecks shouldn’t slow down innovation. By bringing our LTGs into the Altera Partner Solutions portfolio, we are giving designers the power to tackle heat challenges head-on directly at the component level.
Altera Solution Acceleration Partner Program
Launch

Repower-HPC

The RePower-HPC project has officially launched. It aims to revolutionize power delivery for AI/HPC with next-generation energy-efficient power modules based on Hybrid Power Interposer Technology (HyPIT).
Repower-HPC project
Conference

Get a live demo at PCIM

4A-305
We will be exhibiting at PCIM, where we will showcase and demonstrate our latest power and thermal management solutions.
PCIM Expo 2026