Thermal Guide Electrically-Isolated SMT Thermal Jumper
Miniaturized Step-Up Power Supply in Package 100 mA Synchronous Boost Converter
Product in development: The LBK0504 is a miniaturized step-down converter featuring small size and high efficiency.
Compared to the state-of-the-art power module packaging based on laminate substrates and lead frames, the Lotus Power InterposerTM offers up to 60% improvement in thermal performance, with elimination of hot spots. That allows for higher power density and less derating for the same maximum allowable temperature on the application platform.
As current levels in single packages surpass 1000 A, unprecedented challenges arise in the placement and thermal management of point-of-load converters. There is a growing demand for innovative packaging solutions that enable closer placement of power converters to the load and eliminate hot spots. Contact us to learn more about Lotus Microsystems' unique Voltage Regulator Module (VRM) solutions for high-power AI chips, GPUs, and FPGAs.
Power-System-in-Package (PSiP) solutions are widely used in various industrial applications, including telecom and networking, where high-power-density converters with excellent noise immunity and enhanced dynamic performance are essential. Contact us to learn more about Lotus Microsystems' PSiP offerings for optical transceivers and mmWave compact macro platforms.
The growing demand for faster processing speeds (AI at the edge), higher bandwidth communication (5G, 6G), and the integration of more functions into compact devices imposes strict requirements on the size and thermal management of platform power management systems. Power modules featuring Lotus Power Interposer offers innovative features that set new industry benchmarks for W/mm² and °C/W, addressing these market demands.
Lotus Microsystems introduces advanced packaging to the power management field with our proprietary power interposer technology, enabling the use of silicon interposers in power applications. Our interposer design and processes are optimized to handle higher currents and endure higher voltages.
Thick-copper redistribution layer (RDL) patterning
Double-sided wafer routing
Precision silicon etching
High-aspect ratio through-silicon vias (TSV)
Compared to conventional power module packaging using laminate substrates and lead frames, the Lotus Power Interposer delivers up to 60% better thermal performance while eliminating hot spots. This enables higher power density and reduces derating at the maximum allowable temperature on the application platform.
2.5D and 3D packaging for power modules with integrated active and passive components.
Optimized heat distribution of power devices across the substrate in both vertical and lateral paths.
Achieved through lower operating temperatures, minimized parasitics, and an increased allowance for passive components.
Combining multiple technologies, including CMOS, MEMS, GaN, and integrated passive devices (IPDs), into a single package.
Lotus Microsystems is a fabless manufacturer specializing in high-performance integrated power modules. Founded in 2020 by Ph.D. graduates from the Technical University of Denmark (DTU) with expertise in nanofabrication, integrated circuit design, and power electronics, the company’s technology is backed by research that began five years earlier, spanning institutions such as DTU, Harvard University, Fraunhofer, and IMEC.
Lotus Microsystems has received financial support through Danish and European grant schemes, along with multiple investment rounds led primarily by the deep-tech venture firm Noon Ventures. Through partnerships with leading global semiconductor facilities, Lotus Microsystems addresses the growing industry demand for high power density and superior thermal performance in Computing applications and a wide range of electronic devices.
The company’s main office is located in Copenhagen, Denmark, with a subsidiary in Cairo, Egypt.
CPH Business Park
Stamholmen 153
2650 Hvidovre
Denmark
CVR: 41950250
info@lotus-microsystems.com
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