Redefining Power and Thermal Limits in the AI Era

Enabling AI at Data Center Scale

Data centers built for AI and High-Performance Computing demand a fundamental rethinking of power and thermal control. We define a new platform that converges power delivery and thermal management into a unified, purpose-built platform for the next generation of AI and advanced computing.

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Conference

We are presenting at DTU Chip Day

Join us on April 14 at DTU Lyngby in Copenhagen for an afternoon dedicated to the Danish chip design ecosystem.
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New Technical Solution Brief

Vertical LTG - 800G+ Optical Transceiver Modules

We have released a new brief on Vertical LTG integration in 800G+ optical transceivers, covering the conduction model, integration strategies, and key design considerations for reliable thermal performance.
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New collaboartion

Altera Solution Acceleration Partner Program

Thermal bottlenecks shouldn’t slow down innovation. By bringing our LTGs into the Altera Partner Solutions portfolio, we are giving designers the power to tackle heat challenges head-on directly at the component level.
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Launch

Repower-HPC

The RePower-HPC project has officially launched. It aims to revolutionize power delivery for AI/HPC with next-generation energy-efficient power modules based on Hybrid Power Interposer Technology (HyPIT).
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Conference

Get a live demo at PCIM

4A-305
We will be exhibiting at PCIM, where we will showcase and demonstrate our latest power and thermal management solutions.
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