Introducing the Industry’s First Power Silicon Interposer

We deliver the best-in-class power density and highest thermal performance

The Lotus Microsystems power module

Power modules with silicon substrate

The Lotus Microsystems power module

Best-in-Class Power Density

2.5D and 3D packaging for power modules with integrated active and/or passive devices

Superior Thermal Performance

Even heat distribution of power devices across substrate in vertical and lateral paths

High Efficiency

Enabled by lower operating temperatures, reduced parasitics, and larger budget for passive devices

Heterogeneous Integration

Co-packaging of different technologies, e.g. CMOS, MEMS, GaN, and integrated passive devices (IPDs)

Lotus Power InterposerTM

Precise silicon etching

Lotus Microsystems brings advanced packaging to the power management domain. Our proprietary power interposer technology enables the employment of silicon interposers in power applications. The interposer design and processing is optimized to carry higher currents and withstand higher voltages.

Up the power, beat the heat

Heat map Lotus
Heatmap competetion

Compared to the state-of-the-art power module packaging based on laminate substrates and lead frames, the Lotus Power InterposerTM offers up to 60% improvement in thermal performance, with elimination of hot spots. That allows for higher power density and less derating for the same maximum allowable temperature on the application platform.

Animation og the lotus power module vs the competition

Application-Specific Solutions

Consumer Electronics

The ongoing push for increasing processing speeds (AI on the edge), higher bandwidth communication (5G, 6G), and integrating more functions into form-factor specific devices places strict requirements on the size and thermal management of platform power management and delivery system. The Lotus Power Interposer offers unique features that allows for pushing the industry´s figures of merit for W/mm2 and °C/W to new frontiers to cope with the market demand. Get in touch to learn more about our offerings for fast charging of mobile devices.

High-Performance Computing

With the current levels into a single package exceeding 1000 A, unprecedented challenges for the placement and thermal management of point-of-load converters. Innovative packaging solutions that allow for closer placement of the power converters to the load and elimination of hot-spots are in high demand. Get in touch to learn more about Lotus Microsystems´ unique offerings for Voltage Regulator Modules (VRM) for high power AI chips, GPUs and FPGAs.

High-Performance Computing
Industrial Applications

Industrial Applications

Power-System-in-Package (PSiP) solutions are employed in a number of industrial applications, e.g. telecom and networking, with specific needs for high-power-density converters with high noise immunity and improved dynamics. Get in touch to learn more about Lotus Microsystems´ PSiP offerings for optical transceivers and mmWave compact macro platforms.

Standard Products

Product LMS1206

LMS1206

Miniaturized Step-Down Power Supply in Package
6A Synchronous Buck Converter

Features

Applications

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Product LMS5010

LMS5010

Miniaturized Step-Down Power Supply in Package
6A Synchronous Buck Converter

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Applications

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Product LMU20P1

LMU20P1

Miniaturized Step-Up Power Supply in Package
100 mA Synchronous Boost Converter

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Applications

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Lotus building

Who We Are

Lotus Microsystems is a fabless manufacturer of highly-integrated power modules. The company was incorporated in 2020 by three Ph.D. graduates from the Technical University of Denmark (DTU) with expertise in nanofabrication, integrated circuit design, and power electronics. The research behind the technology started five years earlier and spanned across DTU, Harvard University, Fraunhofer, and IMEC. The company has received financial backing from Danish and European grant schemes, in addition to a number of investment rounds primarily led by deep-tech venture firm Noon Ventures. Through partnerships with leading global semiconductor facilities, Lotus Microsystems serves the industry demand for for high power density and superior thermal performance in feature-rich electronic devices.

Lotus Microsystems main office is located in Copenhagen, Denmark, with a company subsidiary based in Cairo, Egypt.

Leadership team

Management team

Hans Hasselby-Andersen

Hans Hasselby-Andersen

CEO

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Yasser Nour

Yasser Nour

CTO, Co-Founder

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Ahmed Ammar

Ahmed Ammar

Head of Product, Co-Founder

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Hoa Le Thanh

Hoa Le Thanh

Head of R&D, Co-Founder

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Uffe Pless

Uffe Pless

Sales Director

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Board of directors

Arve Andersen headshot

Arve Andersen (Chair)

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Ashraf Lotfi

Ashraf Lotfi

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Arend van der Weijden

Arend van der Weijden

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Amir Sheikh

Amir Sheikh

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Casper Hoegh

Caspar Høgh

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Trusted by

Innovation Fund Denmark logo
DTU logo
Noon ventures logo
European innovation council logo

Member of

GSA logo
Danish industry logo

Contact us


CPH Business Park
Stamholmen 153
2650 Hvidovre
Denmark

CVR: 41950250

info@lotus-microsystems.com

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