Apr 16, 2026
The Lotus Microsystems team participated in DTU Chip Day 2026, held at DTU (Technical University of Denmark). The annual half-day event brings together students, researchers, and industry professionals to support collaboration across the Danish semiconductor ecosystem through presentations, exhibitions, and networking.
At the exhibition, Lotus Microsystems presented its latest products in power delivery and thermal management, including live demonstrations of the LMU20P1 boost converter and Lotus Thermal Guides (LTGs).
The program included keynote presentations, technical sessions, and networking opportunities. As part of the technical program, Martin Lantz (IC Design Manager at Lotus Microsystems) gave a presentation on “Cooling the Inferno: Rewriting the Rules of Power and Heat in AI.” The presentation focused on the increasing thermal challenges in modern data centers, where rising power densities are pushing the limits of conventional cooling and power delivery approaches. It also outlined the limitations of existing power conversion technologies in terms of heat and size, and introduced Lotus Microsystems’ solutions, including Power Supply in Package (PSiP) for AI and HPC applications, as well as Power Interposer Technology (PIT).
