Mar 12, 2026
As AI accelerators and high-performance computing (HPC) systems continue to scale, power delivery has emerged as one of the most critical system-level challenges. Increasing power density, tight efficiency margins, and sustainability requirements demand fundamentally new approaches to how power is generated, distributed, and managed close to the compute load.
RePower-HPC is an ambitious project that aims to revolutionize power delivery for AI/HPC with next-generation energy-efficient power modules based on Hybrid Power Interposer Technology (HyPIT), a cost-effective, sustainable, and scalable manufacturing technology for advanced silicon power interposers.
The project is supported by Denmark’s Energy Technology Development and Demonstration Programme (EUDP) and brings together leading industrial and academic partners to accelerate innovation in energy-efficient computing infrastructure.
Within RePower-HPC, project partners Lotus Microsystems, Elplatek, and DTU will scale up interposer manufacturing and develop high-performance power modules, featuring integrated advanced thermal management solutions.
The project is founded on close collaboration between industry and academia, combining applied engineering, advanced manufacturing, and cutting-edge research.
Lotus Microsystems (LMS) will lead the development of breakthrough Hybrid Power Interposer Technology (HyPIT) and coordinate all consortium activities, including project management, dissemination, and commercialization. LMS will establish Denmark's first silicon power interposer pilot line for HyPIT to develop the manufacturing technology. LMS will also drive product development activities, such as Integrated Circuits (ICs) design, in-package thermal management innovation, and system-level integration of HyPIT-based power modules, while conducting real-world demonstrations with Tier-1 customers to validate performance and establish pre-commercial partnerships for scalable, energy-efficient power delivery solutions.
DTU’s expertise in power electronics, nanofabrication, and advanced thermal management solutions will be essential for the development and characterization of power modules featuring silicon interposers. With a state-of-the-art nanofabrication facility at DTU Nanolab, an electronic lab at DTU Electro, and advanced thermal testing capability at DTU Construct, DTU will develop next-generation power delivery architecture for AI and an advanced on-chip cooling solution based on the two-phase liquid cooling technology, which will be incorporated in Lotus Microsystems’ Power Interposer Technology.
Elplatek’s expertise in electrodeposition technologies is crucial for industrialization and scaling of HyPIT. Elplatek will develop key electrodeposition processes and automation solutions for the plating line as part of the HyPIT pilot line.
The Energy Technology Development and Demonstration Programme (EUDP) is a Danish funding program that supports the development and demonstration of new energy technologies. It provides financial support to enterprises and universities working on projects that contribute to the green transition and strengthen energy technology development in Denmark.
Projects such as RePower-HPC illustrate how EUDP funding supports collaboration between research and industry, helping advance energy-efficient technologies and strengthen industrial competitiveness.
The RePower-HPC project officially launched this month, with all partners synchronizing on the project’s strategic goals and operational framework. By establishing a clear roadmap, the consortium has built a strong foundation for upcoming milestones. This early integration has promoted significant knowledge sharing and set the stage for seamless coordination throughout the project’s lifecycle.
