No two thermal challenges are the same. Customized Lotus Thermal Guides are engineered to meet your application’s thermal and mechanical requirements.
Every thermal challenge is different. That’s why Lotus Microsystems offers customized Lotus Thermal Guides designed around your application rather than forcing your design to fit a standard package.
Customized LTGs retain all the advantages of our patented silicon-based thermal jumper technology, including high thermal conductivity and electrical isolation, while allowing engineers to optimize the device for their specific thermal path.
Traditional semiconductor cooling relies on thermal interface materials (TIMs) to transfer heat from the IC package to the heatsink. Because electrically insulating TIMs have relatively low thermal conductivity, they often become the main thermal bottleneck.
The difference in thermal expansion between the semiconductor package and the heatsink also requires a thicker TIM layer to reduce mechanical stress and warpage, which further increases thermal resistance.
As heat spreads laterally through the TIM before reaching the heatsink, cooling becomes less efficient and hotspot removal is limited.
Vertical LTG enables a direct thermal path from the IC package to the heatsink. Its electrically isolated silicon structure allows the use of a thin, highly thermally conductive TIM.
By removing the primary thermal bottleneck, Vertical LTG significantly lowers thermal resistance and transfers heat directly to the heatsink for more efficient cooling and improved hotspot removal.
As optical transceivers evolve to 800G, 1.6T, and beyond, increasing power densities create significant thermal management challenges. High-power components such as DSPs, retimers, and laser driver ICs generate localized hotspots that must be efficiently cooled to maintain performance and reliability.
Vertical Lotus Thermal Guides (LTGs) create a dedicated thermal pathway that transfers heat directly from these hotspots to the module lid while maintaining complete electrical isolation. By bypassing the PCB as the primary heat-spreading path, Vertical LTGs enable more efficient cooling where conventional thermal solutions reach their limits.
As FPGA performance continues to increase, higher power densities create localized hotspots that can limit performance, reliability, and system lifetime. Efficient thermal management is essential, particularly in applications where traditional PCB heat spreading is insufficient.
Vertical Lotus Thermal Guides (LTGs) provide a dedicated, high-conductivity thermal path that transfers heat directly from the FPGA package to the heatsink while maintaining complete electrical isolation.
From concept to production, we work with you to develop a customized LTG tailored to your thermal, electrical, and mechanical requirements.
Contact us
We review your thermal, electrical, and mechanical requirements.
Our engineers optimize the LTG geometry, heat transfer direction, and integration with your thermal stack to maximize heat transfer and overall thermal performance in your design.
We support prototype evaluation, design validation, and the transition to volume production.
