We are excited to share that our CEO, Hans Hasselby-Andersen, was recently interviewed by ipXchange to highlight Lotus Microsystems’ ground breaking work in power electronics.

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In the first of a two-part series, Hans discusses how Lotus Microsystems is pioneering the industry’s first-ever power silicon interposer—a revolutionary platform that enables the co-packaging of power components directly on silicon. This innovation leads to significantly smaller, more powerful modules with superior thermal performance, ideally suited for next-generation computing, datacenter, and AI applications.

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Interview Highlights

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• What is a power silicon interposer, and why does it matter?
• The advantages of co-packaging power electronics on silicon.
• How our modules are reshaping high-performance computing and datacenter systems.
• The role of our thermal bridge components in redefining heat dissipation while preserving electrical integrity.

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This is just the beginning - stay tuned for part two, where we explore more of the technology behind our platform.

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Watch the full interview with Hans here:

‍https://www.youtube.com/watch?v=25qnIXVeR0c

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Read the Full Interview:

https://ipxchange.tech/news/how-to-co-package-power-components-on-silicon/