As current levels in single packages surpass 1000 A, unprecedented challenges arise in the placement and thermal management of point-of-load converters. There is a growing demand for innovative packaging solutions that enable closer placement of power converters to the load and eliminate hot spots. Contact us to learn more about Lotus Microsystems' unique Voltage Regulator Module (VRM) solutions for high-power AI chips, GPUs, and FPGAs.
Power-System-in-Package (PSiP) solutions are widely used in various industrial applications, including telecom and networking, where high-power-density converters with excellent noise immunity and enhanced dynamic performance are essential. Contact us to learn more about Lotus Microsystems' PSiP offerings for optical transceivers and mmWave compact macro platforms.
The growing demand for faster processing speeds (AI at the edge), higher bandwidth communication (5G, 6G), and the integration of more functions into compact devices imposes strict requirements on the size and thermal management of platform power management systems. Power modules featuring Lotus Power Interposer offers innovative features that set new industry benchmarks for W/mm² and °C/W, addressing these market demands.
