AI acceleration, hyperscale computing, and advanced data center architectures demand unprecedented power density, efficiency, and thermal performance. As workloads scale and processors draw thousands of amps at low voltages, power delivery has become a primary system-level constraint.
Lotus Microsystems addresses this challenge with a new class of vertical power delivery solutions, purpose-built for high-current computing platforms. Our fully integrated Power System-in-Package (PSiP) solutions enable power to be delivered closer to the load, minimizing losses, reducing board complexity, and unlocking higher compute density.
At the core of this approach is the vStrata™ Power Series, an ultra-slim, fully integrated high-current power platform designed for the most demanding data center and AI applications.
The vStrata™ Power Series leverages high-performance power conversion, advanced 3D packaging, and our proprietary Lotus Power Interposer® and LTG™ thermal guide technologies.
No external passives required, minimizing parasitics, simplifying system architecture, and saving board space.
An ultra-slim package profile enables low-profile backside power delivery with a tight fit to the load. Vertical power delivery significantly reduces power delivery network losses and avoids the thermal penalties associated with lateral power delivery.
Delivers the highest efficiency in the industry, minimizing self-heating to remove a major constraint in densely packed Artificial Intelligence (AI), Machine Learning (ML), and High-Performance Computing (HPC) systems. This reduces the need for aggressive cooling and ensures stable, high-performance operation in xPU-adjacent, high-temperature environments.
The integrated architecture delivers more than double the current density of leading alternatives, enabling compact, scalable power delivery for advanced accelerators.
Reduced power losses and improved heat extraction unlock significant thermal headroom, enabling up to 2× higher compute performance that would otherwise be constrained by thermal limits.
Scalable power-cluster configurations support multi-kilowatt power delivery for next-generation server and accelerator modules. At the system level, this translates into higher rack density, increased xPU throughput, reduced cooling and energy operational costs, and materially improved total cost of ownership and rack-level revenue generation.
vStrata™ features an innovative hybrid power delivery architecture that seamlessly integrates vertical and lateral approaches.
Patented high-current conversion architecture optimized for extreme current density and efficiency. Purpose-built to minimize conduction and switching losses.
Co-designed electrical and thermal interface that enables vertical power delivery while extracting heat effectively from internal module components. Reduces PDN losses, improves thermal performance, and enables higher sustained compute density.
Ultra-thin, vertically integrated 3D packaging that co-optimizes power delivery, thermal management, and system integration. Eliminates the need for external passives, significantly reduces footprint, and enables scalable, high-density AI and HPC platforms.
