LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.
Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0402, 0603, and 0805) as well as custom sizes.
Evaluation Board User Guide 100 mA Miniaturized Boost Converter
The LMU20P1-EVB is a fully assembled and tested printed circuit board that demonstrates the LMU20P1 miniaturized step-up Power Supply in Package (PSiP). The LMU20P1 itself, offers small size, high efficiency and includes an integrated circuit and an inductor in a compact 2 mm x 2 mm x 0.75 mm package.
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