Lotus Microsystems Thermal Guides
LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.
Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0201, 0402, 0603, 0805, and 1206) as well as custom sizes.
LTG is Lotus Microsystems’ patented technology.
Lotus Microsystems designs LTGs in almost any size, with Cu-Ni-Ag or Cu termination to deliver enhanced thermal resistance. Whether you need lateral or vertical heat transfer, tighter layouts, or a non-standard footprint, our team will shape the LTG precisely to your application.
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Modern dual MOSFETs continue to increase in power density while package sizes become smaller. In common-drain configurations, thermal management is particularly challenging because the electrically active drain node cannot be directly connected to a grounded heatsink or large cooling plane. As a result, the available copper area for heat spreading is limited, leading to higher device temperatures, increased conduction losses, reduced system efficiency, and accelerated component ageing that may shorten device lifetime.
LTG devices provide an electrically isolated thermal path that transfers heat away from the electrically active nodes to a larger grounded copper area without creating an electrical connection.
The application note evaluates LTG0402 and LTG0603 implementations using dedicated evaluation boards. Thermal imaging and electrical measurements compare boards with and without LTGs under identical operating conditions. Testing demonstrated up to 42.9°C lower device temperature, 7.04% lower conduction losses, and improved efficiency.
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The LTG EVB is a fully assembled and tested printed circuit board that demonstrates the LTG thermal guide. LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers.
These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration. The evaluation board uses a resistor to simulate a heat source while demonstrating the functionality of the LTG thermal guides.
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