LBK0504 - Product Brief
LMU20P1_Datasheet
LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.
Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0402, 0603, and 0805) as well as custom sizes.
The LBK0504 evaluation board provides a streamlined platform for device characterization, providing dedicated test points the different signals. The output voltage is adjustable via a user-replaceable feedback resistor, and includes an SMB connector for synchronization to an external clock source.
The board also integrates a microcontroller on the bottom layer to manage register configurations and interface directly with the LMS PRISM Console.
Evaluation Board User Guide 100 mA Miniaturized Boost Converter
The LMU20P1-EVB is a fully assembled and tested printed circuit board that demonstrates the LMU20P1 miniaturized step-up Power Supply in Package (PSiP). The LMU20P1 itself, offers small size, high efficiency and includes an integrated circuit and an inductor in a compact 2 mm x 2 mm x 0.75 mm package.
Interested in evaluating the LBK0504? Register for early access to evaluation boards, engineering samples, and technical support from our engineering team.
