Mar 30, 2026
We are pleased to introduce our latest technical solution brief focused on thermal management in high-performance optical modules.
As optical modules scale to 800G+ and beyond, increasing power densities create significant thermal management challenges. High-power components such as DSPs and driver ICs generate localized hotspots that require efficient heat transfer to the module lid and the host heatsink.
Vertical Lotus Thermal Guides (LTGs) provide a controlled, high-conductivity pathway that enables direct heat conduction while maintaining electrical isolation.
This paper outlines key design principles, practical integration strategies for the thermal stack of high-power optical modules, and key design considerations for achieving reliable and predictable thermal performance in next-generation systems.
You can download the full technical solution brief here.
