Sep 18, 2025
We are pleased to announce the release of our new whitepaper, Smarter Thermal Management for High-Performance Electronics. In this paper, we explore the growing challenges of thermal design in modern electronics and introduce a new silicon-based solution that helps engineers manage heat more effectively.
In high-performance electronic systems, thermal constraints have arguably become the primary design bottleneck. As power densities rise and product footprints shrink, thermal design becomes essential. Yet, in many workflows, thermal management is still treated as a late-stage add-on to be addressed only after electrical and mechanical design are complete. Such a reactive approach is far from ideal, with the result being bulkier heat sinks, overengineered enclosures, and higher BOM costs. Worse, it can compromise reliability, shorten product lifetimes, and even throttle performance.
Instead, the smarter approach is to consider thermal design from the beginning. Just as current paths and signal integrity are architected early, so too should heat paths be planned and embedded at the system level. That’s the philosophy behind the Lotus Thermal Guide (LTG), a drop-in, silicon-based solution that unblocks direct, low thermal resistance pathways within the PCB or package without disrupting the electrical layout. LTGs allow engineers to offload heat from local hotspots to broader thermal domains or dedicated heat spreaders, with minimal impact on size, cost, or manufacturability.
This whitepaper introduces LTG as a new solution for thermal-aware electronics. It explains how the technology works, what sets its silicon architecture apart from conventional materials, and why it is a phenomenal solution for dense, thermally challenging designs.
In high-performance electronic systems, thermal constraints must be addressed as early and deliberately as any electrical or mechanical consideration. The closer heat is managed to its source, the more reliably and efficiently the system will perform.
LTGs offer a fundamentally different approach to thermal management. Instead of relying solely on heatsinks, airflow, or exotic board materials, LTGs introduce a board-level solution that fits directly into the layout. By creating embedded, low-resistance pathways from heat sources to cooler regions or chassis interfaces, LTGs help designers manage thermal gradients without altering system architecture or increasing power draw.
Many applications are already using LTGs to realize tangible improvements like cooler junction temperatures, longer component lifespans, higher sustained performance, and lower system cost. By incorporating LTG early in the design process, engineering teams can eliminate late-stage thermal compromises, reduce mechanical overhead, and build systems that are better prepared for the power densities of modern and future applications.
You can download the full whitepaper here.
